Laird’s PowerCycling Series thermoelectric coolers have been tested to more than 1-million temperature cycles, offering a significantly longer operating life and lower overall cost of ownership compared to standard thermoelectric coolers…
March 30, 2017 – Laird Thermal Systems has improved its advanced Power Cycling Series thermoelectric cooler for applications that require high reliability and high volume thermal cycling between multiple temperature set points. The enhanced PowerCycling Series is now proven to perform more than 1-million temperature cycles, extending the mean time between failure (MTBF) in molecular diagnostics, clinical diagnostics, analytical instrumentation, and more.
Thermal cycling exposes thermoelectric coolers to mechanical stresses as the module contracts and expands from repeated cooling and heating cycles. Standard thermoelectric coolers are traditionally designed for refrigeration applications only. The high-temperature diffusion of impurities and mechanical stresses over time can significantly reduce the operational life of a standard thermoelectric cooler.
The PowerCycling thermoelectric coolers are specially constructed to reduce the amount of stress induced on the thermoelectric elements during operation. This enables the high number of temperature cycles. Combined with an operating temperature up to 120°C, the PowerCycling Series exceeds the requirements for high volume power cycling applications. In addition, the PowerCycling Series provides a lower total cost of ownership, while increasing throughput of diagnostic equipment.
“In modern diagnostic and analytical instruments, thermoelectric coolers are typically used to achieve the rapid temperature changes. Laird’s thermoelectric coolers offer significant advantages when compared to other types of thermal cycling devices including more precise temperature control, compactness, faster temperature ramp rates and efficiency,” said Anders Kottenauer, Senior Vice President of Laird’s Engineered Thermal Systems. “We are ecstatic to announce another milestone in the PowerCycling Series technology, achieving 1-million thermal cycles with minimal degradation.”
The new PowerCycling Series thermoelectric cooler is constructed with multiple layers between the ceramic substrates, copper buss bars and semiconductor couples. To reduce thermally induced stress, a flexible and thermally conductive “soft layer” is inserted between the cold side ceramic substrate and copper buss bars. The integration of the polymer into the thermoelectric coolers absorbs the mechanically induced stresses caused by rapid temperature cycling. As a result, the stress induced on the semiconductor couples and solder joints are significantly reduced, extending the overall operational life of the thermoelectric cooler.
Learn more about the PowerCycling Series thermoelectric coolers here.