OptoTEC™ MSX Series
The MSX Series utilizes advanced ceramic materials, proprietary automation and next-generation thermoelectric materials to boost cooling capacity by as much as 10% and assure high process repeatability.
The multistage TECs offer micro footprints on the cold side down to 2.0 x 4.0 mm’s with height thicknesses down to:
- 3.3 mm’s for 2 stage
- 3.8 mm’s for 3 stage
- 4.9 mm’s for 4 stage
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Sales and Support Centers
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The compact MSX Series is used to deliver deep cooling to well below ambient in high-performance imaging sensing applications including:
- Infrared (IR) Detectors
- Charge-Coupled Devices (CCD)
- Complementary Metal Oxide Semiconductors (CMOS)
- X-Ray Detectors
The applications for this product series tend to be highly customized requiring unique ceramic substrate materials and thicknesses. Two solder constructions are available to accommodate reflow temperatures up to 230°C or 280ºC. MSX is offered in Au-plated pads or uninsulated lead wires for lead attachment.
Series (Solder Construction)
| Model | Solder Type | Melt Temp |
|---|---|---|
| MSX | (SnSb) Tin Antimony | 232°C |
| HSX | (AuSn) Gold Tin | 280°C |
Ceramic Materials
| Solder Type | Thermal Conductivity | Option |
|---|---|---|
| (ALO) Alum Oxide | 24 W/mK | F2 |
| (ALN) Alum Nitride | 170 W/mK | F2N |
Surface Finish Options
| Solder Type | Melt Temp | Option |
|---|---|---|
| Au plating (Hot/Cold Surface) | GG | |
| Non-Metallized Hot and/or Cold face | 11 | |
| Pre-tinning Hot and/or Cold face with 118˚C InSn Solder | 118˚C | 22 |
| Pre-tinning Hot and/or Cold face with 138˚C BiSn Solder | 138˚C | 33 |
Lead Attachment
| Solder Type | Option |
|---|---|
| Uninsulated leads (2 inches) | W2 |
| Au plated Posts | WO |
Optical TEAs
MSX multistage micro thermoelectric coolers are available as a standalone or integrated into an optical package called Optical TEAs. Laird Thermal Systems has a proprietary bonding technique to adhere TECs to optical packages with minimal solder voiding. Solder types used are below melt temperatures of TEC solder construction and optical packaging is specified by the customer.
Minimal to no solder voidingOptical TEA Capabilities
Surface Finish Options
| Solder Type | Melt Type |
|---|---|
| SnInAg | 206°C |
| BiSn | 138°C |
| InSn | 117°C |
