ET12-65-F2A-1312-11-W2.25

Overview: HiTemp Series
The ET12-65-F2A-1312-11-W2.25 high temperature Thermoelectric Module (TEM) uses Laird's enhanced TEM construction preventing performance degrading copper diffusion, which is common in standard grade TEMs operating in high temperature environments exceeding 80 °C. It has a maximum Qc of 5.2 Watts when ΔT = 0 and a maximum ΔT of 68.1 °C at Qc = 0.

Electrical and Thermal Performance Curves

Select Graph
Y - Axis




Select Graph
X - Axis


Imin: 0.2 A
Imax: 1.4 A

Vmin: 1.3 V
Vmax: 8.0 V
Voltage 
Current  
Click UPDATE to view changes in thermal operating conditions
Control Temp  
Ambient Temp  
Δ T  
Hot Side Thermal Resistance  
Cold Side Thermal Resistance  


Electrical Operating Points
Selected Operating Point
Cooling Power (Qc) = Watts
Current = Amps
Voltage = Volts
Power Supply = Watts
COP =
Power Dissipated (Qh) = Watts
Thot = °C
Optimum COP
Cooling Power (Qc) = 1.02 Watts
Current = 0.31 Amps
Voltage = 2.21 Volts
Power Supply = 0.68 Watts
COP = 1.5
Power Dissipated (Qh) = 1.7 Watts
Maximum Qc
Cooling Power (Qc) = 4.08 Watts
Current = 1.36 Amps
Voltage = 8 Volts
Power Supply = 10.92 Watts
COP = 0.37
Power Dissipated (Qh) = 15 Watts


* Any information furnished by Laird Thermal and its agents is believed to be accurate and reliable. All specifications are subject to change without notice.


Specifications
Hot Side Temperature
27.0 °C
35.0 °C
50.0 °C
Qcmax (ΔT = 0)
5.5 Watts
5.7 Watts
5.9 Watts
ΔTmax (Qc = 0)
65.8°C
68.1°C
71.9°C
Imax (I @ Qcmax)
1.4 Amps
1.4 Amps
1.4 Amps
Vmax (V @ Qcmax)
7.8 Volts
8.1 Volts
8.5 Volts
Module Resistance
5.54 Ohms
5.75 Ohms
6.14 Ohms
Max Operating Temperature
150 °C
 
 
Weight
2.0 gram(s)
 
 

Mechanical Options
Suffix
Thickness
Flatness / Parallelism
Hot Face
Cold Face
Lead Length
11
2.692 ±0.051 mm
0.106 ± 0.002 in
0.051 mm / 0.051 mm
0.002 in / 0.002 in
Lapped
Lapped
57.2 mm
2.25 in
Sealing Options
Suffix
Sealant
Color
Temp Range
Description
RT
RTV
White
-60 to 204°C
Non-corrosive, silicone adhesive
EP
Epoxy
Black
-55 to 150°C
Low density syntactic foam epoxy encapsulant

ET12-65-F2A-1312-11-W2.25