ET20-65-F2A-1312-11-W2.25

Overview: HiTemp Series
The ET20-65-F2A-1312-11-W2.25 high temperature Thermoelectric Module (TEM) uses Laird's enhanced TEM construction preventing performance degrading copper diffusion, which is common in standard grade TEMs operating in high temperature environments exceeding 80 °C. It has a maximum Qc of 8.7 Watts when ΔT = 0 and a maximum ΔT of 68.1 °C at Qc = 0.

Electrical and Thermal Performance Curves

Select Graph
Y - Axis




Select Graph
X - Axis


Imin: 0.3 A
Imax: 2.3 A

Vmin: 1.3 V
Vmax: 8.0 V
Voltage 
Current  
Click UPDATE to view changes in thermal operating conditions
Control Temp  
Ambient Temp  
Δ T  
Hot Side Thermal Resistance  
Cold Side Thermal Resistance  


Electrical Operating Points
Selected Operating Point
Cooling Power (Qc) = Watts
Current = Amps
Voltage = Volts
Power Supply = Watts
COP =
Power Dissipated (Qh) = Watts
Thot = °C
Optimum COP
Cooling Power (Qc) = 1.7 Watts
Current = 0.51 Amps
Voltage = 2.21 Volts
Power Supply = 1.13 Watts
COP = 1.5
Power Dissipated (Qh) = 2.84 Watts
Maximum Qc
Cooling Power (Qc) = 6.8 Watts
Current = 2.27 Amps
Voltage = 8 Volts
Power Supply = 18.2 Watts
COP = 0.37
Power Dissipated (Qh) = 25 Watts


* Any information furnished by Laird Thermal and its agents is believed to be accurate and reliable. All specifications are subject to change without notice.


Specifications
Hot Side Temperature
27.0 °C
35.0 °C
50.0 °C
Qcmax (ΔT = 0)
9.2 Watts
9.4 Watts
9.8 Watts
ΔTmax (Qc = 0)
65.8°C
68.1°C
71.9°C
Imax (I @ Qcmax)
2.3 Amps
2.3 Amps
2.3 Amps
Vmax (V @ Qcmax)
7.8 Volts
8.1 Volts
8.5 Volts
Module Resistance
3.32 Ohms
3.45 Ohms
3.68 Ohms
Max Operating Temperature
150 °C
 
 
Weight
2.0 gram(s)
 
 

Mechanical Options
Suffix
Thickness
Flatness / Parallelism
Hot Face
Cold Face
Lead Length
11
2.184 ±0.051 mm
0.086 ± 0.002 in
0.051 mm / 0.051 mm
0.002 in / 0.002 in
Lapped
Lapped
57.2 mm
2.25 in
Sealing Options
Suffix
Sealant
Color
Temp Range
Description
RT
RTV
White
-60 to 204°C
Non-corrosive, silicone adhesive
EP
Epoxy
Black
-55 to 150°C
Low density syntactic foam epoxy encapsulant

ET20-65-F2A-1312-11-W2.25