OptoTEC™ MBX Series
The MBX Series of micro thermoelectric coolers support high-temperature applications with compact geometric space constraints. MBX delivers precise temperature stabilization under changing environmental conditions. The MBX Series offers micro footprints as small as 1.5 x 1.1mm with thicknesses down to 0.65mm. The packing fraction for thermoelectric materials enables high heat pumping densities up to 43 W/cm2 at lower operating currents than traditional thermoelectric coolers.
Solder Construction
| Model | Solder Type | Melt Temp |
|---|---|---|
| MBX | (SnSb) Tin Antimony | 232°C |
| HBX | (AuSn) Gold Tin | 280°C |
Ceramic Materials
| Ceramic Material | Thermal Conductivity | Option |
|---|---|---|
| (ALO) Alum Oxide | 24 W/mK | F2 |
| (ALN) Alum Nitride | 170 W/mK | F2N |
Surface Finish Options*
| Solder Type | Melt Temp | Option |
|---|---|---|
| Au plating (Hot/Cold Surface) | GG | |
| Non-Metallized Hot and/or Cold face | 11 | |
| Pre-tinning Hot and/or Cold face with 118˚C InSn Solder | 118˚C | 22 |
| Pre-tinning Hot and/or Cold face with 138˚C BiSn Solder | 138˚C | 33 |
Lead Attachment
| Solder Type | Option |
|---|---|
| Au plated pads | W0 |
| Au plated Posts | WP |
Custom Options*
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| NTC Thermistor | Au Plated Posts | Ceramic Metallization Patterning | Hermetic Sealing |
* In general these products are highly customized to optimize CoP and footprint constraints. Please contact our sales team to discuss your specific application requirements.
Available as a standalone or integrated into an optical package!




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